HIGH-DENSITY INTERCONNECT PCB - PART 1
Published on 17/07/2026
Introduction to HDI Boards (High-Density Interconnect Boards)
HDI (High-Density Interconnect) boards are advanced printed circuit boards (PCBs) designed with fine traces, micro-vias, and high wiring density to meet the demands of modern electronic devices for miniaturization and high performance.
Key Features of HDI Boards
- High Wiring Density – Trace width/spacing typically less than 100μm (4 mil)
- Micro-Vias – Via diameter usually smaller than 150μm (6 mil)
- Multilayer Structure – Manufactured using build-up technology
- Blind & Buried Vias – Laser drilling enables interlayer connections
- Thin Design – Dielectric layer thickness can be less than 50μm
HDI Board Manufacturing Processes
- Laser Drilling – Used to create micro blind and buried vias
- Via Filling & Plating – Ensures complete conductive material filling
- Fine-Line Imaging – Advanced exposure and etching techniques
- Lamination Process – Multiple pressing for multilayer construction
- Surface Finishing – ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservative), etc.
